Processor Type:
• Control Processor: ARM® System on a Chip (SOC)
• Memory:
• 128 MB SDRAM
• 128 MB Flash Memory
• Error Detection: ECC for single-bit error correction and multiple-bit error detection
Process I/O Communications:
• Fieldbus Type: HDLC
• Transmission Rate:
• 2 Mbps for 200 Series FBMs
• 268 Kbps for 100 Series FBMs
Process I/O Capacity:
• 200 Series FBMs:
• Up to 32 per Expanded Fieldbus
• Up to 128 FBMs over all four Expanded Fieldbuses with 200 Series FBMs
• Mixed with 100 Series FBMs: Up to 128 FBMs, e.g., 64 100 Series and 64 200 Series FBMs
• 100 Series FBMs:
• 64 FBMs per PIO bus/baseplate port
• Total of 128 FBMs per FCP280
• Competitive Migration Modules: Refer to device-specific Product Specification Sheets
Memory Allocation for Blocks:
• Classic OLUG: 15.75 MB
• Enhanced OLUG: 19.75 MB
Maximum Number of Blocks Configured:
• Total: 8,000 (7,993 user-configured)
Block Executions Per Second:
• Maximum: 16,000 blocks/second
Maximum Number of Blocks Processed:
• Depends on: Scan periods and block type selection
Minimum Block Processing Cycle (BPC):
• Time: 50 ms
Sequence Block Size:
• Maximum: 32 kB per block
Maximum Number of IPC Connections:
• Total: 231
• 200 Source Points
• 30 Sink Points
• 1 Internal Use Only
Maximum Number of OM Sink Lists:
• Total: 75
Maximum OM Scanner Database:
• BPC ≥ 200 ms: 18,000 points
• BPC ≤ 100 ms: 7,500 points
Maximum Number of OM Sink Points:
• Total: 11,250
Configurable Block Periods:
• Seconds: 0.05, 0.1, 0.2, 0.5, 0.6, 1, 2, 5, 6, 10, 30
• Minutes: 1, 10, 60
Block Processing Cycle:
• Options: 0.05, 0.1, 0.2, 0.5, 1.0 seconds
Time to Marry Fault-Tolerant Modules:
• Less Than: 0.5 seconds
Internal Diagnostics:
• Self-Checking: At power-up
• Run-Time Checks: Includes watchdog timer and constant synchronization in fault-tolerant mode
Power Requirements:
• Input Voltage: 24 V DC (Redundant)
• Consumption:
• Single Module: 11 W maximum
• Fault-Tolerant Pair: 20 W maximum
Regulatory Compliance and EMC:
• EMC Directive 2014/30/EU: EN 61326-1 Class A
Environmental Specifications:
• Operating Temperature: -20 to 60°C (-4 to 140°F)
• Storage Temperature: -40 to +70°C (-40 to +158°F)
• Relative Humidity: 5 to 95% (Non-condensing)
• Altitude:
• Operating: -300 to +3,000 m (-1,000 to +10,000 ft)
• Storage: -300 to +12,000 m (-1,000 to +40,000 ft)
• Contamination Class: G3 (Harsh)
• Vibration: 0.5 g (5 to 500 Hz)
Physical Specifications:
• Configuration:
• Single processor module
• Fault-tolerant version: Two processor modules with integral fault-tolerant connector
• Mounting: Device-specific 2-position baseplates (horizontal or vertical)
• Dimensions:
• Height: 105 mm (4.13 in) or 116 mm (4.7 in)
• Width: 51.8 mm (2.04 in)
• Depth: 147 mm (5.79 in)
• Weight (Maximum): 0.8 kg (1.76 lb)